Research & Development
R&D Overview
Research & Development
SUNMATE has been deeply engaged in the discrete device sector for over 20 years, possessing full-chain independent R&D capabilities spanning chip design, wafer processing, packaging development, and automotive-grade qualification. We continuously deliver high-performance, high-reliability semiconductor solutions to customers worldwide.
150+ R&D team members
60+ granted invention patents
AEC-Q101 fully qualified across all automotive product lines
8%+ of annual revenue invested in R&D
R&D Bases
SUNMATE has established R&D and manufacturing bases across mainland China, Taiwan, and Hong Kong, forming a complete R&D and production system that spans from chip design to packaging and final delivery.
Changzhou
SUNMATE's mainland headquarters and core R&D manufacturing base is located in Changzhou, covering an area of 50 mu (approx. 33,000 m²). The facility features a Class 10,000 cleanroom, an AEC-Q101 automotive-grade qualification laboratory, and a reliability testing center. It undertakes wafer process development and packaging R&D for the full product portfolio, including TVS, ESD, Zener, Schottky, rectifier bridges, and MOSFETs, with an annual production capacity exceeding 6 billion units. The base has obtained four system certifications: IATF 16949, ISO 9001, ISO 14001, and QC 080000, serving global customers in automotive electronics, industrial control, and consumer electronics.
Shandong
SUNMATE Shandong R&D Center focuses on cutting-edge chip design and new product pre-development. The team possesses advanced semiconductor device simulation capabilities and is responsible for core technology breakthroughs in areas including TVS avalanche breakdown characteristic modeling, Zener voltage regulation accuracy optimization, and MOSFET trench process development.
Jiangxi
SUNMATE Jiangxi Application R&D and Customer Technical Support Center is strategically located adjacent to the global electronics industry cluster. The team focuses on application solution development in consumer electronics, new energy, IoT, and other emerging fields, with the capability to deliver customer-specific sample prototypes within 72 hours.
Packaging Technology
SUNMATE masters a full range of packaging technologies, from ultra-small SMD packages to high-power packages, to meet different application needs.
SMD Packaging
Compact Size with High Packaging Density
SUNMATE's SMD packaging product line covers the full range of package types including SOD-123, SOD-323, SOD-523, SOT-23, SOT-363, SMA, SMB, SMC, with the smallest package size of only 0.6x0.3mm (SOD-523).
Power Packaging
High-Power Thermal Packaging Technology
The power packaging product line covers high-power package types such as ITO-220, ITO-247, ITO-3P, suitable for high-power applications like power supplies and industrial inverters.
Axial Packaging
Traditional & Reliable Axial Packaging
The axial packaging product line includes DO-41, DO-15, DO-201 and other specifications, widely used in traditional fields such as power rectification and industrial control equipment.