Diode packages can be framed or flattened in appearance. What is the difference between the two? — SUNMATE
Diode packages can be framed or flattened in appearance. What is the difference between the two?
1、 The positioning of the chip of the diode frame process product is accurate, and the tin point, chip loading, welding and other processes are all completed in an instant; It can solder 1.9 chips in 1 second, with a very short time; The yield rate can reach 100%.
2、 Diode flattening process products should be completed by installing lead wires, chip welding, covering lead wires, pressing into furnace for 45 minutes and sintering. Errors in any link or human factors will lead to product defects or failure; The surface of the chip is easily scratched, which can lead to excessive leakage current; The yield rate reaches 98% -99%.