What are the differences between the diode frame and the flattened external structure — SUNMATE

1、 Diode frame process products are directly formed by automatic rib cutting, and five products are formed at one time. The flattening process requires products to be flattened with leads and then cut into ribs, forming 50 pieces each time; Due to the inability of each flattening mold to be completely consistent, each mold may not be able to hit the root every time, which brings difficulties to the cutting of ribs and can easily lead to cracking of the body, skewness and asymmetry of pins, inconsistent pin width, and even internal chip damage, leading to excessive leakage current or positive impedance.

2、 When testing printing packaging with TMTT, the quality of frame process products is higher than that of flattening process products in terms of yield and overall pass rate, indicating that the quality of frame products is ahead of flattening products.

3、 The equipment for production of diode frame process products is relatively expensive; However, the yield of flattened products is relatively low. The price of TVS diode products of the same model produced by frame process is a little more expensive than that produced by flattening process.