Diode packaging can be divided into frame and flat in appearance. What is the difference between th — SUNMATE

1、 The chip of the diode frame process product is accurately positioned, and the processes of tin spotting, chip mounting and welding are all completed in an instant; 1.9 chips can be welded in one second, which takes a very short time; The yield can reach 100%.

2、 Diode flattening process products should be completed by installing leads, chip welding, covering leads, pressing into the furnace for 45 minutes and sintering. Errors or human factors in any link will lead to product defects or failures; The chip surface is very easy to scratch, which is easy to cause large leakage current; The rate of good products is 98% - 99%.