What are the differences between diode frame and flattened external structure? — SUNMATE
What are the differences between diode frame and flattened external structure?
The appearance of diode package is different. What is the difference between frame and flattened frame?
1、 Diode frame process products are directly formed by automatic rib cutting, and five products are formed at one time. Flattening process products need to be flattened by leads and then cut ribs, forming 50 pieces at a time; Because each flattening die can not be completely consistent, each die may not be able to hit the root every time, which brings difficulties to the cutting of reinforcement. It is easy to crack the body, skew and asymmetry of pins, inconsistent pin width, etc., and even easy to cause internal chip damage, resulting in large leakage current or large forward impedance.
2、 When testing printing and packaging with tmtt, the frame process products are higher than the flattening process products in terms of yield and overall pass rate. It can be seen that the quality of frame products is ahead of the flattening products.